Epoxy Encapsulant

Product Description

Epoxy Encapsulant

We had been effectively built up a progression of epoxy pitch items, comprising the straightforward optical bundling material, packing material as well as non-optical (auto diode) related items. Our Epoxy Encapsulant for two-segments with great operability, simple de-foaming and long working time. Following molding with great dampness protection, elevated transmittance, extended motion yield, and appropriate for non-noticeable and white item applications. We additionally offered the outline and advancement of Epoxy Encapsulant for unique application. Furthermore, in the auto with dual diode bundle, our business gives a solitary segment, great ease and high sturdiness fixing material.